INTEL AMD DUO CORE 2

INTEL AMD DUO CORE 2
Over the last year or so, since Intel's Core microarchitecture and Conroe core were ready to be unveiled at the Intel Developers Forum in early March '06, Intel has been more open and has allowed the media a view into more details regarding upcoming products much earlier than they had before. You don't have to take our word for it, however. Simply look around at all of the early performance previews out of IDF, and the steady flow of announcements regarding Intel's 45nm manufacturing process, metal gate transistors, the Terascale project, Larrabee, Penryn, Nehalem, and a number of other projects, and it becomes readily apparent that Intel wants to get the word out regarding their future products early and often.

Today's news falls into the category of an early announcement as well; a sneak peek, so to speak. In the coming weeks - sometime later this summer - Intel will be officially launching a whole line of desktop processors that feature 1333MHz front side bus frequencies, which is a healthy boost from the current desktop standard of 1066MHz. We've actually got one of these new 1333MHz FSB-equipped chips in house, the Core 2 Duo E6750, and while we can't disclose all of the details regarding this processor just yet, we can talk about its performance and overclockability.

Intel Core 2 Duo E6750 Processor
2.66GHz Dual Core Processor
1333MHz "Quad-Pumped" front side bus
.065-micron manufacturing process
Shared Smart Cache Technology
4MB on-chip, full-speed L2 cache - Shared across each core
Intel EM64T Extensions - 64-bit computing
Execute Disable Bit - For enhanced security
Streaming SIMD Extensions - SSE2, SSE3
Supported by the Intel P3x / G3x Series chipsets
LGA775 Packaging - Land Grid Array
.85 - 1.3625v operating voltage range
65 - 75 watts TPD (Thermal Design Power)
Die Size: Approximately 143mm2
Approximately 291M Transistors


Intel Core 2 Extreme QX6800 Processor
Core Frequency - 2.93GHz
System Bus Frequency - 1066 MHz
TDP (Thermal Design Power) - 130W
Stepping B-3
Number of CPU Cores - 4
L2 Cache - 8MB (2 x 4 MB)
Core to bus ratio limit 10:1
Max processor input voltage (VID) - 1.350V
.065-micron manufacturing process
Shared Smart Cache Technology
PECI Enabled
Enhanced Intel SpeedStep Technology (EIST)
Extended HALT State (C1E) Enabled
Execute Disable Bit (XD) Enabled
Intel 64 Technology
Intel Virtualization Technology (VT)
Package / Socket - Flip Chip LGA775
Combined Die Size: Approximately 286 mm2
Approximately 582M Transistors
MSRP - $999